{"title":"Soldering Paste","description":"","products":[{"product_id":"beeyuihf-lead-free-solder-paste-138-low-temp-solder-paste-sn42-bi58-solder-flux-tin-cream-solder-flux-paste-for-led-pcb-1-05oz-30g","title":"BEEYUIHF Lead Free Solder Paste, 138 Low Temp Solder Paste, Sn42 Bi58 Solder Flux, Tin Cream, Solder Flux Paste, For LED PCB (1.05oz\/30g)","description":"\u003cp\u003e\u003cstrong\u003eBEEYUIHF Lead Free Solder Paste, 138 Low Temp Solder Paste, Sn42 Bi58 Solder Flux, Tin Cream, welding Flux, For LED PCB,solder paste,solder flux paste,138 solder paste,low temp solder paste,Lead-free solder paste,smd solder paste,welding paste,solder paste flux,138 degrees soldering tin,paste flux,soldering paste,no-clean solder paste,paste,welding tin (1.05oz\/30g)\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eSn42 Bi58 Solder Paste：\u003c\/strong\u003e\u003cbr\u003eLow temperature Solder Paste, melting point: 138°C (280F). \u003c\/p\u003e\n\u003cp\u003eTechnical Parameters: \u003cbr\u003eProduct composition: Sn:42%, Bi:58%.\u003cbr\u003eModel: BEEYUIHF solder tin paste\u003cbr\u003eGross weight: 1.05oz\/30g syringe\u003cbr\u003eMelting Point: 138°C (280F) \u003cbr\u003eParticle size: #3 (25-45 microns) \u003cbr\u003eStorage temperature: 0-10℃\u003cbr\u003ewettability: Bright and uniform solder joints.\u003cbr\u003ePrintability: eliminates missing pits and lumps during printing\u003cbr\u003eProperty: reflow does not create tin beads and tin bridges\u003cbr\u003eLifetime: Can print continuously for more than ten hours at room temperature without producing tin beads\u003cbr\u003eApplication: welding of radiator modules \u0026amp; LED welding \u0026amp; high frequency welding \u0026amp; PCB BGA CPU SMD Rework Tools\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eMelting point 138℃ solder paste: \u003c\/strong\u003e\u003cbr\u003e1、Excellent printability, eliminating the omission of depression and knot fast phenomenon in the printing process\u003cbr\u003e2、Good wettability, bright and even full solder joints\u003cbr\u003e3、without tin beads and tin bridges when soldering back\u003cbr\u003e4, long-term paste life, long stencil printing life\u003cbr\u003e5, suitable for wider process and fast printing\u003cbr\u003e6、Low temperature solder paste is mainly used for heat sink module welding, LED welding, high frequency welding, etc.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eApplication range of low temperature solder paste: \u003c\/strong\u003e\u003cbr\u003eMelting point of 138 ℃ solder paste is called low temperature solder paste, when the SMD components can not withstand the temperature of 200 ℃ and above and the need for SMD reflow process, the use of low temperature solder paste for soldering process. Up to protect can not withstand high temperature reflow soldering original and PCB, especially suitable for LED, its alloy composition is tin-bismuth alloy. Low-temperature solder paste reflow soldering peak temperature at 170-200 ℃.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003ewhat is the solder paste?\u003c\/strong\u003e\u003cbr\u003eTin paste is the liquid after the melting of tin bar. Tin paste refers to the slurry produced by grinding metal tin into a very fine powder and adding flux. It is also called tin slurry. In general, it is most commonly used in wave soldering machines, reflow soldering machines, tin furnaces, etc.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e138°C (280F) Melting Point\u003c\/strong\u003e\u003cbr\u003eLow temperature tin is often used for the maintenance of electronic products. The melting point of Low Temperature Tin is 138 degrees Celsius, the particle size of tin powder is between 25 and 45 microns. Low temperature tin is mainly used for elements that can not withstand high temperature device.\u003c\/p\u003e","brand":"BEEYUIHF","offers":[{"title":"Default Title","offer_id":51910560317621,"sku":"SF-BF35-138","price":12.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0977\/9013\/2405\/files\/BEEYUIHFLeadFreeSolderPaste_138LowTempSolderPaste_Sn42Bi58SolderFlux_TinCream_SolderFluxPaste_ForLEDPCB_1.05oz30g_1.webp?v=1779948708"},{"product_id":"beeyuihf-solder-paste-electronic-soldering-paste-with-flux-sn64-bi35-ag1-lead-free-smd-solder-paste-for-pcb-ic-smd-led-bga-qfn-smt-electronics-1-23oz-35g","title":"BEEYUIHF Solder Paste, Electronic Soldering Paste with Flux, Sn64 Bi35 Ag1 Lead-free SMD Solder Paste for PCB IC SMD LED BGA QFN SMT electronics (1.23oz\/35g)","description":"\u003cp\u003e\u003cstrong\u003eBEEYUIHF Solder Paste, Electronic Soldering Paste with Flux, Sn64 Bi35 Ag1 Lead-free SMD Solder Paste for PCB IC SMD LED BGA QFN SMT electronics (1.23oz\/35g)\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eSn64\/Bi35\/Ag1：\u003c\/strong\u003e\u003cbr\u003eLead-free medium temperature solder paste, Melting point: 183°C\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eTechnical parameter: \u003c\/strong\u003e\u003cbr\u003eProduct composition: Sn:64%, Bi:35%, Ag:1%\u003cbr\u003eModel:   BEEYUIHF Solder Tin Paste\u003cbr\u003eGross weight:  10cc\/35g syringe\u003cbr\u003eMelting Point: 183℃ (361F) \u003cbr\u003eParticle Size: #4 (20-38 microns) \u003cbr\u003eStorage temperature: 2-10℃\u003cbr\u003ewettability: Bright \u0026amp; Even solder joints\u003cbr\u003ePrintability: Eliminate missing pits and knots during printing\u003cbr\u003eFeature: Reflow does not produce tin beads and tin bridge\u003cbr\u003eService Life: Can print continuously for more than ten hours at room temperature without producing tin beads\u003cbr\u003eApplication: Radiator module welding \u0026amp; LED welding \u0026amp; High frequency welding \u0026amp; CB BGA CPU SMD Rework Tools\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003ewhat is the Solder Tin Paste?\u003c\/strong\u003e\u003cbr\u003eTin paste is the fluid formed after the tin bar is melted. Tin paste refers to the mud made by grinding metal tin into a very fine powder and adding flux. Also called tin mud. Generally, the most commonly used places are used in wave soldering machines, reflow soldering machines, tin furnaces and so on.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e183℃ (361F) Melting Point\u003c\/strong\u003e\u003cbr\u003eMedium temperature tin is often used for maintenance of electronic products. The melting point of medium temperature tin is about 183 degrees Celsius. Its alloy components are tin, silver, bismuth, etc., and the particle size of tin powder is between 25 microns and 45 microns. Medium temperature tin is mainly used for elements that cannot withstand high temperatures. device.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003ewide range of products:\u003c\/strong\u003e\u003cbr\u003eMainly used for welding sensors, wires, motors, fuses, connectors, metal shells, lighting, electronic components, SMT maintenance, BGA chip ball planting, ect. of electronic components such as PCB surface resistance, capacitors and IC in the SMT industry.\u003c\/p\u003e","brand":"BEEYUIHF","offers":[{"title":"Default Title","offer_id":51910561398965,"sku":"SF-9300-35g","price":12.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0977\/9013\/2405\/files\/BEEYUIHFSolderPaste_ElectronicSolderingPastewithFlux_Sn64Bi35Ag1Lead-freeSMDSolderPasteforPCBICSMDLEDBGAQFNSMTelectronics_1.23oz35g_1.webp?v=1779775499"}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0977\/9013\/2405\/collections\/solder_paste_solder_flux_paste_138_solder_paste_low_temp_solder_paste_Lead-free_solder_paste_smd_solder_paste_welding_paste_solder_paste_flux_138_degree_1.jpg?v=1774342559","url":"https:\/\/www.beeyuihf.com\/collections\/soldering-paste.oembed","provider":"BEEYUIHF","version":"1.0","type":"link"}