BEEYUIHF Lead Free Solder Paste, 138 Low Temp Solder Paste, Sn42 Bi58 Solder Flux, Tin Cream, Solder Flux Paste, For LED PCB (1.05oz/30g)

Solder paste composition: Sn:42%, Bi:58%.

Low temperature solder paste, melting point: 138°C (280F) , low temp solder paste suit for electronic components that cannot withstand temperatures of 200°C and above and require a SMD reflow process, especially for LED.

Lead free solder flux gross weight: 1.05oz/30g syringe;  Particle size: #3 (25-45 microns) 

Syringe solder flux paste property: lead free/smooth & uniform solder joints/reflow does not create tin beads and tin bridges.

Lead free solder flux tin paste Application: welding radiator modules & LED welding & high frequency welding & LED PCB BGA CPU SMT rework tools.