Description
BEEYUIHF Solder Paste, Electronic Soldering Paste with Flux, Sn64 Bi35 Ag1 Lead-free SMD Solder Paste for PCB IC SMD LED BGA QFN SMT electronics (1.23oz/35g)
Sn64/Bi35/Ag1：
Lead-free medium temperature solder paste, Melting point: 183°C
Technical parameter:
Product composition: Sn:64%, Bi:35%, Ag:1%
Model: BEEYUIHF Solder Tin Paste
Gross weight: 10cc/35g syringe
Melting Point: 183℃ (361F)
Particle Size: #4 (20-38 microns)
Storage temperature: 2-10℃
wettability: Bright & Even solder joints
Printability: Eliminate missing pits and knots during printing
Feature: Reflow does not produce tin beads and tin bridge
Service Life: Can print continuously for more than ten hours at room temperature without producing tin beads
Application: Radiator module welding & LED welding & High frequency welding & CB BGA CPU SMD Rework Tools
what is the Solder Tin Paste?
Tin paste is the fluid formed after the tin bar is melted. Tin paste refers to the mud made by grinding metal tin into a very fine powder and adding flux. Also called tin mud. Generally, the most commonly used places are used in wave soldering machines, reflow soldering machines, tin furnaces and so on.
183℃ (361F) Melting Point
Medium temperature tin is often used for maintenance of electronic products. The melting point of medium temperature tin is about 183 degrees Celsius. Its alloy components are tin, silver, bismuth, etc., and the particle size of tin powder is between 25 microns and 45 microns. Medium temperature tin is mainly used for elements that cannot withstand high temperatures. device.
wide range of products:
Mainly used for welding sensors, wires, motors, fuses, connectors, metal shells, lighting, electronic components, SMT maintenance, BGA chip ball planting, ect. of electronic components such as PCB surface resistance, capacitors and IC in the SMT industry.
